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Dielectric Constant 3.8 Mhz Cpu Thermal Pad Soft Compressible For Memory Modules

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Dongguan Ziitek Electronical Material and Technology Ltd.

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Dielectric Constant 3.8 Mhz Cpu Thermal Pad Soft Compressible For Memory Modules

Name: Dielectric Constant 38 Mhz Cpu Thermal Pad Soft Compressible For Memory Modules
Brand: Ziitek
Price: 0.1 USD

Wholesale Dielectric Constant 3.8 Mhz Cpu Thermal Pad Soft Compressible For Memory Modules from china suppliers

Brand Name : Ziitek

Model Number : TIF1120-30-02US thermal pad

Certification : UL

Place of Origin : China

MOQ : 1000 pcs

Price : 0.1-10 USD/PCS

Payment Terms : T/T

Supply Ability : 100000pcs/month

Delivery Time : 3-8 work days

Packaging Details : 25*24*13cm canton

Dielectric constant@1MHz : 3.8 MHz

Product Name : TIF1120-30-02US Series

Application : power supply

color : gray

Name : Dielectric constant 3.8 MHz Soft and Compressible Thermal Pad for Memory Modules

keyword : Thermal Gap Pad

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Dielectric constant 3.8 MHz Soft and Compressible Thermal Pad for Memory Modules

Company Profile

With professional R&D capabilities and over 13 year experiences in thermal interface material industry, Ziitek company own many unique formulations which are our core technologies and advantages. Our goal is to provide quality & competitive products to our customers worldwide aiming for long-term business cooperation.

TIF100-30-02US-Datasheet-REV02.pdf

Ziitek TIF1120-30-02US is not only designed to take advantage of the gap heat transfer, to fill gaps, complete the heat transfer between heating and cooling parts, but also played insulation, damping, sealing and so on, to meet the equipment miniaturization and ultra-thin design Requirements, which is a highly technology and use, and the thickness of the wide range of applications, is also an excellent thermal conductivity filler material.

<Good thermal conductive:3.0W/mK

<Thickness:3.0mmT

<Hardness:20 Shore 00

<Colour: gray

<RoHS compliant

<UL recognized

<Easy release construction

Applications

<mainboard/mother board

<notebook

<power supply

<Heat pipe thermal solutions

<Memory Modules

<Mass storage devices

Typical Properties of TIF1120-30-02US
Product Name	TIF1120-30-02US Series
Colour	Gray
Construction & Compostion	Ceramic filled silicone elastomer
Specific gravity	2.9 g/cc
Thickness	3.0mmT
Hardness	20 Shore 00
Dielectric constant@1MHz	3.8 MHz
Continuos Use Temp	-40 to 160℃
Dielectric Breakdown Voltage	>5500 VAC
Thermal conductivity	3.0 W/mK
Volume Resistivity	1.0*10^{12 _Ohm-cm}

Standard Sheets Sizes:

8" x 16"(203mm x 406mm)

TIF™ series Individual die cut shapes can be supplied.

Dielectric Constant 3.8 Mhz Cpu Thermal Pad Soft Compressible For Memory Modules

Why Choose us ?

1.Our value message is'' Do it right the First time, total quality control''.

2.Our core competencies is thermal conductive interface materials

3.Competitive advantage products.

4.Condidentiality agreement Bussiness Secrect Contract

5.Free sample offer

6.Quality assurance contract

Dielectric Constant 3.8 Mhz Cpu Thermal Pad Soft Compressible For Memory Modules

FAQ

Q: How long is your delivery time?

A: Generally it is 3-7 work days if the goods are in stock. or it is 7-10 work days if the goods are not in stock, it is according to quantity.

Q: Do you provide samples ? is it free or extra cost?

A: Yes, we could offer samples free of charge.

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Dielectric Constant 3.8 Mhz Cpu Thermal Pad Soft Compressible For Memory Modules

Dielectric Constant 3.8 Mhz Cpu Thermal Pad Soft Compressible For Memory Modules

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Dielectric Constant 3.8 Mhz Cpu Thermal Pad Soft Compressible For Memory Modules Images